Broadcom Outlines Ethernet, PCIe and Optical Networking Portfolio for OCP 2026
The October 8 announcement describes ORV3 rack networking for scale-up, scale-out and scale-across AI clusters; it is not a new data-center capacity announcement.
Broadcom announced on October 8 that its 2026 Open Compute Project Global Summit program would bring Ethernet switches, network-interface cards, PCIe components and integrated optics into Open Rack Version 3 solutions for AI infrastructure. The summit runs October 12–15 in San Jose, California.
The named networking portfolio includes Tomahawk 6, Tomahawk Ultra and Jericho 4 switches; Thor Ultra 800G and Thor 2 400G Ethernet NICs; and third-generation TH6-Davisson co-packaged optics. Broadcom positions these components across scale-up, scale-out and scale-across networks serving AI clusters.
The infrastructure focus is how switching, host connectivity and optics fit together within rack and cluster designs. The announcement does not provide a project investment value, a customer deployment schedule or newly commissioned computing capacity.
This is coverage of Broadcom’s October 8 portfolio and summit announcement, not a claim that every listed component was launched on that date. Product performance assertions remain the manufacturer’s claims. The reviewed material also does not independently confirm which scheduled summit presentations have taken place.
Broadcom announcement — October 8, 2026 · AI Infrastructure. Sources reviewed: October 14, 2026.