NVIDIA Supply Agreements Target Major AI Packaging and Optics Expansion
NVIDIA announced capacity agreements across substrates, advanced packaging, testing and optics, including a US$1.1 billion advance supporting planned U.S. KYEC facilities.
NVIDIA announced October 21 a set of supply-chain capacity agreements covering substrates, advanced packaging, testing and optical engines. The company expects substrate capacity from its agreements with IBIDEN, Samsung Electro-Mechanics and Unimicron to rise 2.5 times over three years.
Amkor plans to increase advanced-packaging capacity by more than 300% by the end of 2028. King Yuan Electronics plans new U.S. facilities supported by a US$1.1 billion NVIDIA capacity-reservation advance, while Siliconware Precision Industries targets a 15-fold increase in optical-engine capacity by mid-2027.
These are announced plans and capacity targets, not completed facilities. The disclosure identifies manufacturing bottlenecks and prospective U.S. investment, but it does not provide precise KYEC sites, construction budgets or permitting schedules.
Official source · Development date: October 21, 2026; source reviewed October 22, 2026.